Conference Program
Wednesday, 15th of May
| 15:00 | Arrival, registration, accommodation | Location: Residence Emmy Hotel |
| 19:00 | Welcome Party | Location: Conference Venue |
| 21:00 | Steering Committee meeting | Location: Auditorium 0.195 |
Thursday, 16th of May
| 08:30 | Opening session of ISSE 2024 | Location: Milan Hasek Auditorium |
| Welcome speech Oliver Krammer and Karel Dusek | ||
| 08:45 | Oral session I chaired by: O. Krammer and K. Dusek | Location: Milan Hasek Auditorium |
| KN01 | 10 Golden Rules of Chip- Package- Board Interactions Evelyn Napetschnig (Infineon Technologies AG) | |
| KN02 | Technological Status Quo for High-end RF Printed Circuit Board Development at Rohde&Schwarz Franz Röhrl (Rohde&Schwarz) | |
| D32 | Electrochemical Migration: Evaluating the Effect of Fe2O3 Nanoparticle Incorporation on the Reliability of SAC Alloys Ali Gharaibeh (Budapest University of Technology and Economics) | |
| D53 | Assessing Impact of Creep and Random Vibration on BGA Solder Interconnects Through Finite Element Analysis (FEA) Sabuj Mallik (Buckinghamshire New University) | |
| D102 | Adhesion Measurements of Polyimide to SixNy for Semiconductor Component Applications Moritz Hartleb (KAI Kompetenzzenturm Automobil- und Industrieelektronik GmbH) | |
| 10:45 | Coffee break | |
| 11:00 | Oral session II chaired by: P. Mach and J. Nicolics | Location: Milan Hasek Auditorium |
| KN03 | Chiplet Design and Heterogeneous Integration Packaging John H Lau (Unimicron Technology Corporation) | |
| B37 | Thermal Diffusivity Determination of a Semiconductor Device Corina Ruxandra Mitulescu (National University of Science and Technology Politehnica Bucharest) | |
| C46 | Experimental Study of a Novel Printed Circuit Board Interconnection Technology Karamat Adavi (Huber Automotive AG) | |
| 12:30 | Lunch | Location: Conference Venue |
| 13:30 | Poster session I chaired by: R. Kisiel and H. Wohlrabe | Location: Milan Hasek Auditorium, Exhibition Hall |
| D01 | Power Cycling Lifetime Improvement in Aluminum Wire Bonding Process Hyeon Min Jeong (Infineon) | |
| D03 | How Different Cleaning Procedures Affect Reliability of Conductive Joints on E-Textiles Martin Hirman (University of West Bohemia) | |
| D04 | Moisture Resistance Enhancing of E-Textiles Martin Hirman (University of West Bohemia) | |
| D07 | Electrochemical Migration Resistance of Gold Surface Finishes Marketa Klimtova (Czech Technical University in Prague) | |
| D17 | Development of Sensor Emulators for Testing the Safety Mechanisms of Sensor Interfaces in Automotive Electronics Nicolae Gross (University Politehnica of Bucharest) | |
| D21 | Analysis of Electronic Modules for Construction Machines and Development of a Reliability Test Method Max Häusler (Technical University of Dresden) | |
| D23 | Electrochemical Migration: What Happens If You Pour Coke into Computer Petr Vesely (Czech Technical University in Prague) | |
| F12 | 3D Printed Circuit Boards from Recycled Plastics: Interconnection Properties Jakub Zdrahal (Czech Technical University in Prague) | |
| F18 | Hydrogen in Automotive: LCA Study Michael Fridrich (Czech Technical University in Prague) | |
| F28 | Towards Sustainable Electronics: Unveiling the Nexus of Circular Economy, Global Policies and Industry Impacts Andrea Benesova (University of West Bohemia) | |
| F47 | Soil Degradation of Sustainable PLA/Flax Substrates and Printed Circuit Board Assemblies Csaba Farkas (Budapest University of Technology and Economics) | |
| F74 | Biodegradable Comb Sensor Based on 3D Printed Conductive Polylactic Acid Peter Lukacs (Technical University of Kosice) | |
| F92 | Sustainability in Electronics – Testing Sensors with Polycarbonate Housing (PC) vs Poly Lactic Acid Housing (PLA) Ioan Szabo (University Politehnica of Bucharest) | |
| F99 | Increasing Productivity in Vapour Phase Soldering Using Stack-mode Gergo Havellant (Budapest University of Technology and Informatics) | |
| F108 | Sustainability Challenges: The Circular Economy Dilemma in Lithium-Ion Battery Cell Electrochemical Discharging Processes Anna Prazanova (Czech Technical University in Prague) | |
| 15:00 | Coffee break | |
| 15:15 | Oral session III chaired by: S. Stoyanov and E. Ceuca | Location: Milan Hasek Auditorium |
| KN04 | Soldering Defects and Their Arduous Solution in PCB Assembly at Rohde & Schwarz Vaclav Wirth (Rohde&Schwarz) | |
| E43 | Distributed System Using Synthetic Data of Lithium-ion Battery Digital Twin for Battery Diagnosis Eliza M Olariu (Technical University of Cluj Napoca) | |
| E95 | Study of Thermal Loading of Ceramic Capacitors during Reflow Soldering Steffen Wiese (Saarland University) | |
| E98 | Knowledge Mining using Generative AI for Causal Discovery in Electronics Production Sven Meier (Friedrich-Alexander-University Erlangen-Nürnberg) | |
| 16:45 | Coffee break | |
| 17:00 | Poster session II chaired by: K. Nieweglowski and B. Mihailescu | Location: Milan Hasek Auditorium, Exhibition Hall |
| A02 | Towards Additively Manufactured Alumina Substrates for Printed Electronics Applications Martin Janda (University of West Bohemia) | |
| A19 | Analysis of Composite BiSn Solder Paste Doped by Titanium Dioxide Nanoparticles Iva Kralova (Czech Technical University in Prague) | |
| A22 | 3D printing Conductive Pastes Based on Polystyrene/Graphite Composite Jonas Uricar (Czech Technical University in Prague) | |
| A36 | The Effect of Oxide Reduction Using Formic Acid Vapours on The Thickness of The Conductive Layer David Michal (University of West Bohemia) | |
| A44 | NTC Thermistor Ferrite Composite for Temperature Sensing with Reduced Humidity Influence Maria Nikolic (University of Belgrade) | |
| A45 | Effect of electro(less) plating on mechanical and geometric properties of polymer-metal structures based on 3D printed models Radek Tucek (Czech Technical University in Prague) | |
| A48 | Stretchability of Printed Conductive Structures for Thermoformable Structural Electronics Adam Urban (University of West Bohemia) | |
| A49 | Design of a Flat Coil Electrothermal Vaporization Device for Inductively Coupled Plasma Optical Emission Spectrometry Patarau Toma (Tehnical University of Cluj Napoca) | |
| A87 | Printed Piezoelectric Harvester for Integration in a Wearable Energy Storage Device Mariya Aleksandrova (Technical University of Sofia) | |
| A118 | Thick-film CuNi-Ag and CuNi-Cu Thermocouples and Thermoelectric Microgenerators Andrzej Dziedzic (Wroclaw University of Science and Technology) | |
| A119 | Thick_Film Thermoelectric Structures Based on Ca3Co4O9-Ag and Ca2.7Bi0.3Co4O9-Ag Thermopiles Andrzej Dziedzic (Wroclaw University of Science and Technology) | |
| H14 | A Dual-Band Wilkinson Power Divider Using Compact Lowpass Filter with Wide Suppression Band Saeedeh Lotfi (University of West Bohemia) | |
| H15 | Design of a Quadrature Hybrid Coupler with Triple Tapered Resonators Saeedeh Lotfi (University of West Bohemia) | |
| H16 | Design of a Compact Lowpass Filter with an Ultra-wide Stopband using Triangular Resonators Saeedeh Lotfi (University of West Bohemia) | |
| H85 | Textile-Based Flexible Coaxial Cable Jan Handrejch (University of West Bohemia | |
| 19:00 | Dinner | Location: Conference Venue |
Friday, 17th of May
| 08:30 | Oral session IV chaired by: A. Geczy and J. Morris | Location: Milan Hasek Auditorium |
| KN05 | Contrasting Reliable Systems – Automotives and Mobiles Nihal Sinnadurai (Advanced Technology Transfer Associates) | |
| KN06 | Component Packages and Their Influence on the Climatic Reliability of Assemblies Vladimir Sitko (PBT Works) | |
| A58 | Additively Printed Heating Structure for Radome De-icing Application Kok Siong Siah (Institute for Factory Automation and Production Systems at Friedrich-Alexander-Universität Erlangen-Nürnberg) | |
| A71 | Laser Powder Bed Fusion of Titanium Alloyed Copper Powder for Power Electronic Substrates Christoph Hecht (Friedrich-Alexander-Universität Erlangen-Nürnberg) | |
| 10:30 | Coffee break | |
| 10:45 | Poster session III chaired by: A. Dziedzic and M. Kisic | Location: Milan Hasek Auditorium, Exhibition Hall |
| I05 | Development an Ultra-Low Power “Coin” Size Sensor Elitsa E Gieva (Technical University of Sofia) | |
| I26 | Design and Implementation of an Electronic Encryption System based on PCA algorithm Petre Anghelescu (National University of Science and Technology Politehnica Bucharest) | |
| I29 | Thermal Junction of NTC Chip Thermistors Milan Bodic (Faculty of Technical Sciences Novi Sad) | |
| I30 | Differential Thermal Voltammetry for States-of-Health (SOH) Estimation of Li-ion Batteries Miroslav Mikolasek (Slovak University of Technology) | |
| I31 | Evaluation of Semipermeable Membranes for Encapsuling Gas Sensors in Human Intestinal Environments Felix Stadermann (Institute for electronics packaging – TU Dresden) | |
| I38 | Realization of Cost-Effective Supercapacitors Utilising Substitutable Materials Irina Madalina Burcea (National University of Science and Technology Politehnica Bucharest) | |
| I40 | Highly Elastic Textile Conductive Ribbons as Frequency Resonators for Wearable Strain Monitoring Michaela Radouchova (University of West Bohemia) | |
| I42 | Modelling and Simulation of a Two-Stage Grid-Connected MPPT Inverter Patarau Toma (Tehnical University of Cluj Napoca) | |
| I56 | Evaluating the Performance of Measurements Systems Using Data Processing Methods Based on Kalman Filter Alexandru F Flutur (Technical University of Cluj-Napoca) | |
| I63 | Multifunctional Inkjet-Printed Silver Structures for Wearable Biosensors Rade Tomov (Technical University of Sofia) | |
| I70 | A TeraRanger One based LiDAR Pena D Madalina (1 Decembrie 1918 University Alba Iulia) | |
| I80 | Design of Navigation System with Wireless Connectivity Rosen Miletiev (Technical University of Sofia) | |
| I82 | 3-axis Accelerometer IMU in Various Degrees of Freedom Multi-switch Button Array Slavomir Kardos (Technical University of Kosice) | |
| I83 | Nitrogen Dioxide Sensor based on Organic Electrochemical Transistor Josef Slauf (University of West Bohemia) | |
| I89 | Noise Measurement System Based on Cross-Correlation Method Ana Cristina Davidas (Technical University of Cluj-Napoca) | |
| I96 | Electronic Nose Based on AI-capable Sensor Module for Beverages Identification Attila Géczy (Budapest University of Technology and Informatics) | |
| I111 | Stretchable Strain Sensor using Interdigitated Capacitor on Fabric Milica Kisic (University of Novi Sad) | |
| I112 | Influence of Number of Turns on Common-Mode Choke’s Characteristics Mirjana Damnjanovic(University of Novi Sad) | |
| I122 | Master-Slave BMS Architecture with CAN-bus for Inter-Cell Communication Lucian Perisoara (University Politehnica of Bucharest) | |
| 12:30 | Lunch | Location: Conference Venue |
| 13:30 | Oral session V chaired by: P. Lukacs and A. Tulbure | Location: Milan Hasek Auditorium |
| KN07 | AI in production – Magic AOI Jakub Altman (Continental) | |
| A104 | Flexible Frequency Selective Surfaces Olga Rac-Rumijowska (Wrocław University of Science and Technology) | |
| A113 | Influences on the Mechanical Strength of Inkjet-Printed, Ag-Nanoparticle-Based Interconnects of Ni-Ag Finished Fine-Pitch Components Christian Voigt (Friedrich-Alexander-University Erlangen-Nürnberg) | |
| H10 | Propagation Delay Analysis by Employing Various PCB Manufacturing Process Jae-Ho Choi (Samsung Electronics) | |
| 16:00 | Social program | |
| 19:00 | Dinner | Location: Strahov Monastery |
| 21:00 | Social program | |
Saturday, 18th of May
| 09:00 | Poster session IV chaired by: T. Blecha and F. Steiner | Location: Milan Hasek Auditorium, Exhibition Hall |
| D24 | Development of Computationally Efficient Numerical Models for Assessing the Reliability of Electronic Components under Vibration Loads Chengzhe Lyu (Technical University of Dresden) | |
| D33 | Effect of New Types of PCB Surface Finishes on Fractographic Morphology of Solder Joints Daniel Dzivy (Technical University of Kosice) | |
| D41 | Effect of TiO2 Nanoparticles Addition on the Electrochemical Migration of Lead-Free Sn-Bi Alloys Ali Dayoub (Budapest University of Technology and Economics) | |
| D50 | Occurrence of Voids in Soldered Joints for Electrical Engineering Tomas Chvosta (Czech Technical University in Prague) | |
| D59 | The Use of Scatter Plot Charts for the Study of Changes in the Electrical Parameters of Conductive Adhesive Joints Pavel Mach (Czech Technical University in Prague) | |
| D60 | Effect of Post-Annealing on Electrical Parameters of Joints Formed from Conductive Adhesive Pavel Mach (Czech Technical University in Prague) | |
| D61 | Influence of Reflow Temperature Profile on the Intermetallic Layers Thickness at Different Surface Finishes Karel Dusek (Czech Technical University in Prague) | |
| D64 | Effect of Manufacturing Technology on Polymer Thick-film Resistors in 3D Printed Structures Igor Vehec (Technical University of Kosice) | |
| D66 | Lithium-Ion Cell and Battery Testing by Spectral Analysis Krasimir Kishkin (Technical University of Sofia) | |
| D67 | Effects of Thermal Cycling and PCB Substrate Type on Reliability of Solder Joints Daniel Fros (Czech Technical University in Prague) | |
| D68 | Board Level Underfill – Moisture Related Voids Zbynek Plachy (Czech Technical University in Prague) | |
| D76 | Electrical Properties’ Stability of Flexible Carbon-Based Conductive Layers Peter Lukacs (Technical University of Kosice) | |
| D79 | Utilization of Microextraction-gas Chromatography Coupled to Mass Spectrometry for Characterization of Electrotechnology Materials Dominik Pilnaj (Czech Technical University in Prague) | |
| D81 | Stability of OhmegaPly Resistors with Different Shapes Tomas Lenger (Technical University of Kosice) | |
| D88 | Analyzing the Impact of Surface Treatment on Solder Joint Voids Pavel Rous (University of West Bohemia) | |
| D94 | The Use of Bending Experiments for the Efficient Characterization of the Mechanical Functionality of Component Interconnections Erik Wiss (Saarland University) | |
| D105 | Variations in Open Circuit Voltage of Cycle-Aged Lithium-Ion Batteries due to Silicon-Enhanced Anodes Michele Galasso (Czech Technical University in Prague) | |
| D117 | The Set-up for Seebeck Coefficient Characterisation of Film Materials Piotr M Markowski (Wrocław University of Science and Technology) | |
| D123 | An Expired Solder Paste vs Fresh Solder Paste: Reliability and Sustainability in Electronics Manufacturing David Busek (Czech Technical University in Prague) | |
| 10:30 | Coffee break | |
| 10:45 | Poster session V chaired by: E. Gieva and M. V. Nikolic | Location: Milan Hasek Auditorium, Exhibition Hall |
| E06 | Intra-Day Optimal Dispatching of an Islanded Microgrid under Solar Power Uncertainty Nicolae A Sarbu (Technical University of Cluj-Napoca) | |
| E09 | Modelling the Effect of Laser-Trimming on the Electrical Properties of Thick-film Resistors Oliver Krammer (Budapest University of Technology and Economics) | |
| E27 | Active Balancing of Li-ion Battery Cells Using the DC2100B-C and DC2100B-D Module Mirela Olteanu (Technical University of Cluj-Napoca) | |
| E39 | Investigation of Sn Grain Growth in Solder Joints by Numerical Simulations István Bozsóki (Budapest University of Technology and Economics) | |
| E54 | Reliability Meta-modelling of Power Components Stoyan Stoyanov (University of Greenwich) | |
| E57 | Optimal Resource Scheduling for a Greenhouse Powered by an Islanded Microgrid Nicoleta Stroia (Technical University of Cluj-Napoca) | |
| E97 | Modelling of Battery Management System based on Switching Capacitors Dimitar Arnaudov (Technical University of Sofia) | |
| E103 | FCCSP Warpage Scope Evaluation for 5G Product with Advanced Wafer Node TzuChi Zeng (Siliconware Precision Industries) | |
| E107 | State-of-Charge Estimation Based on Open-Circuit Voltage Model Considering Hysteresis Vaclav Knap (Czech Technical University in Prague) | |
| E116 | Simulation of Electrochemical Heating in Li-Ion Batteries Jan Zemen (Czech Technical University in Prague) | |
| B55 | A Simple and Cost-Efficient Method for Lithium-ion Battery Thermal Parameter Identification Faisal Rehman (Czech Technical University in Prague) | |
| C11 | Low Temperature Adhesive Die Bonding for Sensitive MEMS Dies Lukas Lorenz (Fraunhofer Institute for Photonic Microsystems) | |
| C110 | Silver Sintering Application in Packaging Al Metallized Chip onto Au Metallized Substrates Marcin Mysliwiec (Warsaw University of Technology) | |
| G25 | Iron Nanoparticle-Doped Flux: Wetting Characteristics of Flux and SAC305 Solder and Effects on Flux Viscosity Irina Wodak (TU Wien) | |
| G73 | TCAD model of GAA Nanowire Transistor with silicon oxide/nitride/oxide dielectric Rostislav Rusev (Technical University of Sofia) | |
| G75 | Investigation of In-Situ Polymerization in Nanocomposites Alexandra Borok (Budapest University of Technology and Economics) | |
| G84 | Detection of Nucleotides Using Gold Nanoprisms Immobilized on Glass Nora Tarpataki (Budapest University of Technology and Economics) | |
| G86 | Modeling the Optical Response of a Periodic Nanoparticle Arrangement with the Finite Element Method Rebeka Kovacs (Budapest University of Technology and Economics) | |
| G121 | Investigation of Polymer Nanocomposites Doped with Gold Nanorods and Alexa Fluor Indicator Molecules with Raman Spectroscopy Shereen Zangana (Budapest University of Technology and Economics) | |
| J90 | Training Cost Analysis on a Large Computer Vision Ceramic Defect Detection Model Adrian V Tulbure (“1 Decembrie 1918” University of Alba Iulia) | |
| 12:30 | Lunch | Location: Conference Venue |
| 13:30 | Oral session VI chaired by: P. Markowski and D. Busek | Location: Milan Hasek Auditorium |
| I62 | Portable Device for In-Situ Cyclic Voltammetry Measurements Mitar Simic (University of Novi Sad) | |
| F65 | Unlocking Insights: A Systematic Survey of Material Composition in Lithium-Ion Battery Cells for Recycling Solutions Jan Koci (Czech Technical University in Prague) | |
| 14:15 | Closing ceremony – invitation to ISSE 2025 | Location: Milan Hasek Auditorium |
| 14:45 | Social program | |
| 18:00 | Steering committee meeting | Location: Milan Hasek Auditorium |
| 19:00 | Awarding ceremony | Location: Conference Venue |
| 19:30 | Dinner | Location: Conference Venue |
Sunday, 19th of May
| 09:00 | Farewell; End of conference |