International Steering Committee
| Member’s First Name |
Name & Title | Affiliation | Fields of interest and competency |
Reviewer for the topics |
Additional topics for poster evaluation |
|
|---|---|---|---|---|---|---|
| Anna | Andonova Stoynova |
Technical University Sofia Faculty of Electronic Engineering and Technologies Blvd. Kl. Ohridski no 8 1000 Sofia, Bulgaria |
ava@ecad.tu-sofia.bg | Quality and reliability in electronics; thermal management; non-destructive evaluation (NDE); PCB design; ESD; MMS ; sensors |
B, D |
E, I |
| Chris | Bailey Univ. Prof. |
Greenwich University, Maritime Greenwich Campus Old Royal Naval College Park Row, Greenwich London SE10 9LS, UK |
c.bailey@greenwich.ac.uk | Multiphysics modelling; thermal management and optimization; reliability |
E | … |
| Reinhard | Bauer | University of Applied Sciences Dresden Faculty of Electrical Engineering Fr.-List-Platz 1 01069 Dresden, Germany |
bauer@htw-dresden.de | Thick film; LTCC; innovative packaging; reliability; sensors; microsystems; SMT |
I, K |
… |
| Tomáš | Blecha | University of West Bohemia Faculty of Electrical Engineering Univerzitni 8 306 14 Pilsen, Czech Republic |
tblesi@ket.zcu.cz | Electronic devices and materials; RF technology; electrical testing; modeling and simulation; ESD |
D, H, K |
… |
| Detlef | Bonfert Dr. |
Fraunhofer Institute for Electronic Microsystems and Solid-State Technologies, EMFT Hansastr. 27d 80686 Munich, Germany |
Detlef.Bonfert@emft.fraunhofer.de | Electrical testing; reliability; materials and technology of polytronics |
D, K, G |
… |
| Attila | Bonyár, Prof. Dr. |
Budapest University of Technology and Economics Department of Electronics Technology Egry József u. 18. 1111 Budapest, Hungary |
bonyar@ett.bme.hu | Sensors and actuators, biomedical engineering |
E, F, I |
… |
| Radu | Bozomitu | “Gh. Asachi” Technical University of Iasi Faculty of Electronics and Telecommunications Bd. Carol I No. 11 700560 Iasi, Romania |
bozomitu@etti.tuiasi.ro | VLSI, CMOS, circuit design, Signal integrity, quality management |
D, E, H, K |
… |
| Mihai | Branzei Prof. Dr. |
University POLITEHNICA of Bucharest Faculty of Materials Science and Engineering 313 Spl. Independentei, Sector 6 060042 Bucharest, Romania |
mihai.branzei@upb.ro | Education; casting; (electronic) materials and (reflow) soldering; thermophysical properties; assembling and quality assessment |
A, B, D |
A, B, D |
| David | Bušek | Czech Technical University in Prague Department of Electrotechnology Technická 2 166 27, Prague, Czech Republic |
busekd1@fel.cvut.cz | Soldering; reliability issues; stress tests; electrically conductive adhesives |
C, D |
A, F, G, (I) |
| Vlad | Cehan | “Gh. Asachi” Technical University of Iasi Faculty of Electronics and Telecommunications Bd. Carol I No. 11 700560 Iasi, Romania |
vlcehan@etti.tuiasi.ro | Circuit and systems; modelling and simulation; electromagnetic compatibility; field simulation; PCB-Design and testing in RF |
E, I |
… |
| Emilian | Ceuca Prof. Dr. |
University “1 Decembrie 1918” Department Electronics, Faculty of Science Str. N. Iorga, Nr. 11-13 510009, Alba Iulia, Romania |
eceuca@uab.ro | Sensors; actuators |
E, I |
… |
| Norocel | Codreanu Prof. |
Politehnica University of Bucharest Splaiul Independentei 313 060042, Bucharest, Romania |
norocel.codreanu@cetti.ro | Electronic packaging, thermal management |
C, H, I, J |
C, H, I, J |
| Karel | Dušek Dr. |
Czech Technical University in Prague Faculty of Electrical Engineering Technická 2 166 27, Prague, Czech Republic |
dusekk1@fel.cvut.cz | Soldering; PCB; electronic assembly; quality and reliability; education |
C, D, J |
C, D, J |
| Andrzej | Dziedzic Prof. Dr. |
Wrocław University of Science and Technology Faculty of Microsystem Electronics and Photonics Wybrzeże Wyspiańskiego 27 50-370 Wrocław, Poland |
Andrzej.Dziedzic@pwr.wroc.pl | Thick-film and LTCC technology; sensors and microsystems; quality and reliability; education |
D, K |
… |
| Jan | Felba Prof. ret. Dr. |
Wrocław University of Science and Technology Faculty of Microsystem Electronics and Photonics Wybrzeże Wyspiańskiego 27 50-370 Wrocław, Poland |
Jan.Felba@pwr.wroc.pl | Materials and technology of packaging; reliability; polymer and flexible electronics |
D | … |
| Attila | Géczy, Ass.Prof. Dr. |
Budapest University of Technology and Economics Department of Electronics Technology Egry József u. 18. 1111 Budapest, Hungary |
gattila@ett.bme.hu | Interconnection technology, vapor phase soldering, quality management |
B, C, D, E |
… |
| Leszek | Golonka Prof. ret. Dr. |
Wrocław University of Science and Technology Faculty of Microsystem Electronics and Photonics Wybrzeże Wyspiańskiego 27 50-370 Wrocław, Poland |
golonka@pwr.wroc.pl | Education; thick film technology; LTCC; packaging; reliability; microsystems; sensors |
D, I, J |
… |
| Balázs | Illés Assoc. Prof. Dr. |
Budapest University of Technology and Economics Department of Electronics Technology Egry József u. 18. 1111 Budapest, Hungary |
billes@ett.bme.hu | Thermal simulation; reflow soldering; metallurgy; reliability of electronic circuits |
B, C, D, E |
… |
| Zsolt | Illyefalvi-Vitez | Budapest University of Technology and Economics Department of Electronics Technology Egry József u. 18. 1111 Budapest, Hungary |
illye@ett.bme.hu | Microsystem technology; assembly and soldering; laser processing |
A, C |
… |
| Ciprian | Ionescu Prof. Dr. |
Politehnica University of Bucharest Splaiul Independentei 313 060042, Bucharest, Romania |
ciprian.ionescu@cetti.ro | PCB and sensor packaging; thermal management |
B, I |
… |
| Małgorzata | Jakubowska | Warsaw University of Technology Institute of Precision and Biomedical Engineering Ul. sw. Andrzeja Boboli 8 02-525 Warszawa, Poland |
maljakub@mchtr.pw.edu.pl | Biomedical engineering |
F, J |
… |
| Golta | Khatibi Prof. Dr. |
Inst. of Chemical Technologies and Analytics, TU Wien, Getreidemarkt 9/164CT, A-1060 Vienna |
golta.khatibi@tuwien.ac.at | Electronic materials, interconnection techniques, mechanical reliability |
A, C, D, K |
… |
| Milica | Kisic | University of Novi Sad, Serbia |
||||
| Ryszard | Kisiel | Warsaw University of Technology Institute of Microelectronics and Optoelectronics Koszykowa 75 00662, Warszawa, Poland |
r.kisiel@imio.pw.edu.pl | Interconnection technology; adhesives; packaging technology; electronic materials; ecology |
A, C, F |
… |
| Oliver | Krammer Dr. Secretary |
Budapest University of Technology and Economics Department of Electronics Technology Egry József u. 18. 1111 Budapest, Hungary |
krammer@ett.bme.hu | Assembly and soldering; mechanical testing; quality and reliability of electronic circuits |
A, C, D |
B, E, F |
| Ioan | Liţă | University of Pitesti Faculty of Electronics, Communications, and Computers |
ioan.lita@upit.ro | Electronic communication; materials; components; system integration. |
E, I, J |
… |
| Peter | Lukacs | Fakulta elektrotechniky a informatiky TUKE Letná 9 042 00 Košice |
peter.lukacs@tuke.sk | material science and technologies in electronics, flexible electronics and nano-materials |
A, C, D, G |
… |
| Pavel | Mach Prof. ret. |
Czech Technical University in Prague Faculty of Electrical Engineering Technická 2 166 27, Prague, Czech Republic |
mach@fel.cvut.cz | ic | C, D |
… |
| Piotr | Markowski | Wrocław University of Science and Technology Faculty of Microsystem Electronics and Photonics Wybrzeże Wyspiańskiego 27 50-370 Wrocław, Poland |
piotr.markowski@pwr.edu.pl | Thick-film and LTCC technology; energy harvesting; sensors and microsystems; education |
B, I |
… |
| Petko Hristov | Mashkov | University of Rousse Bulgaria Rousse-7000 |
pmashkov@uni-ruse.bg | Thermal management; environmental and ecology |
B, F |
… |
| Bogdan | Mihalescu | Politehnica University of Bucharest Splaiul Independentei 313 060042, Bucharest, Romania |
bogdan.mihailescu@cetti.ro | |||
| Goran | Mišković | Silicon Austria Labs GmbH High Tech Campus Villach ‑ Europastraße 12 |
goran.miskovic@silicon-austria.com | Gas sensors, microsystem technology |
||
| Madalin | Moise | Politehnica University of Bucharest Splaiul Independentei 313 060042, Bucharest, Romania |
||||
| James E. | Morris Prof. ret. |
Portland State University Oregon, USA |
j.e.morris@ieee.org | Education; electronics packaging; electrically conductive adhesives; electrical interconnect modeling; nanoelectronics; thin films; sensors |
A, C, G, J |
… |
| Nencho | Nenov Prof. |
Geo Milev Str. 158 Bulgaria Sofia 1574 |
nnenov_58@abv.bg | Sensors and sensor systems in transport |
I, J |
… |
| Johann | Nicolics Assoc.Prof. ret. Dr. |
Vienna University of Technology Inst. 366 + Inst. E164-03-2 Gusshausstraße 27-29 1040 Wien, Austria |
johann.nicolics@tuwien.ac.at | materials science; electronics technology; interconnection technology; thermal management, power electronics packaging |
A, B, C, D, E, F, I, K |
… |
| Maria Vesna | Nikolić PhD |
Department of Materials Science, IMSI, Institute for Multidisciplinary Research Kneza Viseslava 1, 11000 Belgrade, Serbia |
mariavesna@imsi.rs | Electronic materials, sensors, Synthesis and characterization of oxides, Infrared and photoacoustic spectroscopy. Electric and magnetic properties |
A, D, G, I |
… |
| Ostap Остап |
Oliinyk Олійник |
National Technical University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute” KPI |
ostap.oliinyk@gmail.com | Electronic systems (telecommunication, computer networks, SAW devices, opto- and magneto-electronics, non-destructive testing), Theory of information Devices based on the modulation polarimetry technique (allow to detect in real time extremely small mechanical stresses and tensions in solids caused by heat flux, deformation or defects), |
A, D, E, H, I |
|
| Tamara | Pencheva | University of Rousse Bulgaria Rousse-7000 |
tgp@ru.acad.bg | Thin solid films; optoelectronic devices; optical communications |
K, J |
… |
| Alena | Pietriková Prof. Dr. |
Technical University of Košice Letná 9 040 01 Košice, Slovakia |
alena.pietrikova@tuke.sk | Thick film; LTCC; lead-free solders; materials science; reliability issues; sensors |
A, I |
… |
| Dan | Pitică Univ.Prof. |
Technical University of Cluj-Napoca Str. Constantin Daicoviciu nr. 15 400020 Cluj-Napoca, Romania |
Dan.Pitica@ael.utcluj.ro | Electromagnetic compatibility; signal integrity; PCB design |
H | … |
| Ovidiu | Pop Prof.dr.ing. |
Applied Electronics Department Technical University of Cluj-Napoca |
ovidiu.pop@ael.utcluj.ro | electronics devices and circuits, modelling and simulation of electronics devices and circuits, GMR and other magneto-electric devices, sensors, IoT, embedded systems, Power electronics, especially DC-DC and DC-AC converters |
E, H |
|
| Goran | Radosavljevic Dr. |
Dyson Singapore Technology Centre, Ascent, Dyson Operation Pte Ltd, Tower B 2 Science Park Drive, #03-13/26 Singapore Science Park 1 Singapore 118222 |
Goran.Radosavljevic@dyson.com | Advanced packaging and Interconnection Technologies |
C, I |
… |
| František | Steiner Dr. |
University of West Bohemia Faculty of Electrical Engineering Univerzitni 8 306 14 Pilsen, Czech Republic |
steiner@ket.zcu.cz | Diagnostics; soldering; interconnection technology; electronic assemblies; testing; quality and reliability of electronics |
C, D |
A, E, F, J |
| Stoyan | Stoyanov | Greenwich University Maritime Greenwich Campus Old Royal Naval College Park Row, Greenwich SE10 9LS London, UK |
s.stoyanov@gre.ac.uk | Multi-physics simulation; design; optimisation; reliability and physics-of-failure modelling; risk analysis; thermal management |
E, C, D, B |
… |
| Paul | Svasta Univ.Prof. ret. Dr. |
Politehnica University of Bucharest Splaiul Independentei 313 060042, Bucharest, Romania |
paul.svasta@cetti.ro | education; thin film technology; solders; printed circuit board and surface mount technology |
H, J |
… |
| Ivan | Szendiuch Prof. ret. |
Brno University of Technology Department of Microelectronics, FEEC, Údolní 244/53 60200 Brno, Czech Republic |
szend@feec.vutbr.cz | Thick films; lead-free SMT; 3D pack-stacked; SPC; eco-design |
D, F |
… |
| Adrian | Tulbure | University “1 Decembrie 1918” Department Electronics, Faculty of Science Str. N. Iorga, Nr. 11-13 510009, Alba Iulia, Romania |
||||
| Heinz | Wohlrabe Prof. ret. Dr. General Chairman, |
Dresden University of Technology Centre of Microtechnical Production 01062 Dresden, Germany |
heinz.wohlrabe@tu-dresden.de | Quality assurance in SMT; DoE; SPC; reliability |
D, C |
J, A, B |
| Klaus-Jürgen | Wolter Prof. Dr. |
Dresden University of Technology Electronics Packaging Lab 01062 Dresden, Germany |
klaus-juergen.wolter@tu-dresden.d | Interconnection and packaging technology; nondestructive testing and evaluation; optoelectronic interconnect |
A, C, D |
… |
| Ljiljana | Zivanov | University of Novi Sad, Serbia |
lilaziv@uns.ac.rs | |||